Press Releases

LIVINGSTON, UK — July 12, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced that Dr. Craig Ciesla has joined the company as Vice President of Engineering. Reporting to Dr. Bardia Pezeshki, President and Chief Executive Officer, Ciesla will lead the Development and Engineering teams in both the California and Scotland sites and push the roadmap on advanced components...

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MEMS-based coupling of CW lasers and Kaiam’s Planar Lightwave Circuit (PLC) technology complement highly integrated optoelectronics in a low-cost, high-performance CWDM module ANAHEIM, CA — March 17, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, is demonstrating the world’s first 100Gb/s CWDM4 silicon photonics transceiver at the largest global conference for optical communications, OFC 2016.   To showcase the capability of its industry-leading...

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Another leap in Scottish-US technology collaboration LIVINGSTON, SCOTLAND, UK — February 10, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, along with SU2P, announce that following a meeting between Sir Jim McDonald, Principal and Vice Chancellor of the University of Strathclyde and Bardia Pezeshki, CEO of Kaiam Corporation, Kaiam is delighted to confirm that the company has agreed to become an...

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LIVINGSTON, UK — September 28, 2015 — Kaiam Corporation, a leader in high-speed datacenter transceivers, announced sampling lead customers with 100G QSFP28 CWDM4 and CLR4 transceivers manufactured in its high-volume production facility in Livingston, Scotland. Kaiam has pioneered a low-cost manufacturing approach to single-mode optics based on hybrid integration of wafer-based components. The UK factory produces silica-on-silicon integrated optics and silicon MEMS wafers combined in...

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Joint Demonstration Showcases MACOM’s High Speed Optical and Photonic Content for Next Generation 400G Applications LOWELL, MA — March 23, 2015 — M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance analog RF, microwave and optical semiconductor products, today announced it will be collaborating with Kaiam Corporation (Kaiam) to showcase an industry leading 400G demonstration at OFC in Los Angeles, March 24-26, 2015.   MACOM is consolidating...

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MEMS-based photonic integration allows the highest performance multi-wavelength transceivers NEWARK, CA — March 19, 2015 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced availability of their 100Gb/s QSFP28 transceiver. The uncooled CWDM transceiver is aimed at CWDM4 and CLR4 low-cost data center applications. Kaiam is now sampling select customers with both the transceiver and 4x25Gb/s TOSA/ROSAs, with volume production...

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NEWARK, CA — February 4, 2015 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced that Dr. Ron Kaneshiro has joined the company as Vice President of Engineering, responsible for high-end modules that use the proprietary MEMS-based integrated optical engines.   “We are extremely pleased to have Ron joining our team,” said Dr. Bardia Pezeshki, President and Chief Executive Officer of Kaiam....

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Strategic Partners Lead New Round to Support Volume Production of Transceivers NEWARK, CA — September 22, 2014 — Kaiam Corporation, a leader in hybrid photonic integration, today announced that the company has closed a new investment round of approximately $35 million, nearly doubling the total amount of equity investment raised by the company since its inception. The round was jointly led by two new strategic investors,...

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Consortium Surpasses 15 Member Mark Gaining Substantial Industry-Wide Participation and Adoption SAN JOSE, CA — September 9, 2014 — The CWDM4 MSA consortium today released the first detailed specification (revision 1.0) for low cost 100G interfaces targeting data center applications. Formed in March 2014, the CWDM4 MSA targets a common specification for 100G optical interfaces that addresses data communication links up to 2 kilometers in the...

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Former Ovum Analyst to Lead Marketing Efforts for Growing Optical Components Company NEWARK, CA — May 12, 2014 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced that Dr. Karen Liu has joined the company as Vice President of Marketing, responsible for the product roadmap and expansion of the product portfolio using the proprietary MEMS-based integrated optical circuit platform.   “We are extremely...

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Optical Components Company Specializing in Photonic Integrated Circuits to Build a New Production Facility in Livingston LIVINGSTON, SCOTLAND, UK — April 6, 2014 — A U.S. based optical components company, Kaiam Corporation, will secure 103 jobs in Livingston, First Minister Alex Salmond has announced.   Kaiam Corporation, headquartered in California, will relocate production facilities to Scotland from China and expand its existing Livingston site.   The project is...

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The 100Gb/s TOSA, realized with Kaiam’s MEMS-based optical integration technology, can be used in compact QSFP transceivers for low power consumption applications NEWARK CA — March 11, 2014 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, will demonstrate a 100Gb/s (four lanes at 28Gb/s) transmitter optical subassembly at OFC 2014, booth #1735. Current 100Gb/s transceivers are generally too large, and consume too...

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